Advanced Technology / Materials / Composites / R & D
Asia

2019 Microelectronics Show – 33rd ADVANCED ELECTRONICS PACKAGING EXHIBITION

2019 Microelectronics Show – 33rd ADVANCED ELECTRONICS PACKAGING EXHIBITION
- Products with high-density/high-frequency electronics mount technologies, High-density substrates/interposer, Semiconductor chips, Electronic Components, SiP, Display/Optical Device, Lead-free solder&Bonding material, Production Facilities, and more.
2019/06/05 - 2019/06/07
2019/06/05 -

Held with concurrent exhibitions.

Screenshot of www.jpcashow.com